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Proceedings of the Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP

Institute of Electrical and Electronics Engineers Inc.United States (Northern America)

Active in Scopusjournal
1H-Index
0.00CiteScore
24Total Dokumen
0Sitasi 3 Tahun
11.7Ref/Dokumen
#32,085Rank Global
0Dokumen 3 Tahun

Identitas

ISSN Print
2836-8487
ISSN Electronic
2768-1874
Cakupan Tahun
2025
Scopus Source ID
21101393119

Bidang Subjek

  • Engineering
  • Materials Science
  • Mathematics
  • Physics and Astronomy

Kategori

  • Control and Optimization
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Safety, Risk, Reliability and Quality

Tautan

Proceedings of the Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP — SJR - | ScopusLens Publiora